A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components....http://www.google.fr/patents/US5354593?utm_source=gb-gplus-shareBrevet US5354593 - Multilayer circuit board having microporous layers and method for making same
Multilayer circuit board having microporous layers and method for making same
