A microelectromechanical system (MEMS) assembly includes a MEMS substrate having a plurality of MEMS devices, a plurality of bond pads, and a wafer cap. The wafer cap includes a unitary structure having a plurality of pockets and a plurality of apertures. The wafer cap is fixed to the MEMS substrate...http://www.google.fr/patents/US20070284681?utm_source=gb-gplus-shareBrevet US20070284681 - APPARATUS AND METHOD FOR PROTECTIVE COVERING OF MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES
APPARATUS AND METHOD FOR PROTECTIVE COVERING OF MICROELECTROMECHANICAL ...
