An improved sputtering process increases the perpendicularity of the sputtered flux to the target surface by bombarding the target with both low and high mass ions, with low mass ions predominating, packing the target with both low and high mass implanted ions, and causing target atoms ejected...http://www.google.fr/patents/US5750012?utm_source=gb-gplus-shareBrevet US5750012 - Multiple species sputtering for improved bottom coverage and improved sputter rate
Multiple species sputtering for improved bottom coverage and improved ...
