An exemplary semiconductor package includes a substrate, at least one passive component, an insulative layer and a chip. The substrate defines a cavity therein. The at least one passive component is disposed within the cavity, and is electrically connected to the substrate. The insulative layer is received...http://www.google.fr/patents/US20080251875?utm_source=gb-gplus-shareBrevet US20080251875 - SEMICONDUCTOR PACKAGE
