A method for interconnecting at least one semiconductor chip (14 or 36) having chip pads (16 or 38) includes applying a removable polymer layer (22 or 44) over the chip; forming vias (26 or 50) in the polymer layer aligned with predetermined chip pads; depositing a pattern of electrical conductors...http://www.google.fr/patents/US5672546?utm_source=gb-gplus-shareBrevet US5672546 - Semiconductor interconnect method and structure for high temperature applications
Semiconductor interconnect method and structure for high temperature ...
