A self-aligning method and apparatus for magnetically transferring semiconductor chips to corresponding fingers of a conductive lead frame for bonding thereto. A chip having a plurality of soft ferromagnetic integral leads on one face thereof is positioned face up, below overlying soft ferromagnetic...http://www.google.fr/patents/US3960279?utm_source=gb-gplus-shareBrevet US3960279 - Magnetic alignment for semiconductor device bonding
Magnetic alignment for semiconductor device bonding
