There are many inventions described and illustrated herein. In one aspect, present invention is directed to a thin film or wafer encapsulated MEMS, and technique of fabricating or manufacturing a thin film or wafer encapsulated MEMS employing the anti-stiction techniques of the present invention. In...http://www.google.fr/patents/US20050095833?utm_source=gb-gplus-shareBrevet US20050095833 - Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
Anti-stiction technique for thin film and wafer-bonded encapsulated ...
Numéro de demande: 10/698,258 Numéro de publication: US 2005/0095833 A1 Date de dépôt: 31 oct. 2003 Brevet délivré: US6930367 ( Date de délivrance 16 août 2005)
