A method of depositing a metal seed layer with underlying barrier layer on a wafer substrate comprising a plurality of recessed device features. A first portion of the barrier layer is deposited on the wafer substrate without excessive build-up of barrier layer material on the openings to the plurality...http://www.google.fr/patents/US8158511?utm_source=gb-gplus-shareBrevet US8158511 - Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features
Method of depositing a uniform barrier layer and metal seed layer with ...
