A method for forming flip chip bumps or UBM for a high speed copper interconnect chip, and more particularly to a method for forming a flip chip bump or UBM of copper/nickel, copper/nickel/copper or etc. which are carried out by a subsequent process of electroless copper plating and electroless nickel...http://www.google.fr/patents/US6362090?utm_source=gb-gplus-shareBrevet US6362090 - Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method
Method for forming flip chip bump and UBM for high speed copper interconnect ...
