An apparatus to heat and test a semiconductor wafer includes a probe card and tests a plurality of die simultaneously at the wafer level. In the present invention, the apparatus heats the wafer to sufficient temperatures to perform burn-in and a speed test. A method of testing the semiconductor allows...http://www.google.fr/patents/US6265888?utm_source=gb-gplus-shareBrevet US6265888 - Wafer probe card
