A main wall part is provided so as to surround an integrated circuit part. A sub-wall part which is in “L” shape is provided between each corner of the main wall part and the integrated circuit part. Therefore, even if the stress is concentrated due to heat treatment or the like, the stress is dispersed...http://www.google.fr/patents/US7129565?utm_source=gb-gplus-shareBrevet US7129565 - Semiconductor device, method of manufacturing the same, and phase shift mask
Semiconductor device, method of manufacturing the same, and phase shift mask
