An internal connection output pad (14A) connected to a CMOS output circuit (15A, 16A) on a first chip (11A) is electrically connected via a chip-to-chip bonding wire (17) to an internal connection input pad (14B) connected to a CMOS input circuit (15B, 16B) on a second chip (11B). In order to inspect...http://www.google.fr/patents/US7843206?utm_source=gb-gplus-shareBrevet US7843206 - Semiconductor integrated circuit and method for inspecting same
Semiconductor integrated circuit and method for inspecting same
