Embodiments of a method of forming a tapered via using a receding mask are disclosed. In one embodiment, an etch mask formed on a substrate includes a first aperture in a first photoresist layer and a second, larger aperture in an overlying second photoresist layer. Peripheries of the first and second...http://www.google.fr/patents/US20060094231?utm_source=gb-gplus-shareBrevet US20060094231 - Method of creating a tapered via using a receding mask and resulting structure
Method of creating a tapered via using a receding mask and resulting structure
Numéro de demande: 10/975,572 Numéro de publication: US 2006/0094231 A1 Date de dépôt: 28 oct. 2004 Brevet délivré: US7081408 ( Date de délivrance 25 juil. 2006)
