A polishing pad for use in polishing a surface of a substrate comprises a pad main body having a polishing surface and a plurality of electrode portions formed within the pad main body and mutually spaced apart in a plane direction of the pad main body. Each electrode portion is formed of a conductive...http://www.google.fr/patents/US20010024878?utm_source=gb-gplus-shareBrevet US20010024878 - Polishing pad, polishing apparatus and polishing method
Polishing pad, polishing apparatus and polishing method
Numéro de demande: 09/816,169 Numéro de publication: US 2001/0024878 A1 Date de dépôt: 26 mars 2001 Brevet délivré: US6620336 ( Date de délivrance 16 sept. 2003)
