The present invention relates to a chip sized integrated circuit package. A device package embodying the invention includes: an insulative substrate having a plurality of conductive first lands formed on an upper surface of the substrate and a plurality of conductive second lands formed on a lower surface...http://www.google.fr/patents/US6278178?utm_source=gb-gplus-shareBrevet US6278178 - Integrated device package and fabrication methods thereof
Integrated device package and fabrication methods thereof
