A method, circuit and system for determining burn-in reliability from wafer level burn-in are disclosed. The method includes recording the number of failures in each IC die in nonvolatile elements on-chip at points in time over the duration of wafer level burn-in testing. Methods may also include using...http://www.google.fr/patents/US7279918?utm_source=gb-gplus-shareBrevet US7279918 - Methods for wafer level burn-in
