A semiconductor device assembly includes a first semiconductor die, such as a logic device, with bond pads arranged in an array on an active surface thereof, and at least one second semiconductor die, such as a memory device or an ancillary or parallel logic device, with bond pads on an active surface...http://www.google.fr/patents/US6906408?utm_source=gb-gplus-shareBrevet US6906408 - Assemblies and packages including die-to-die connections
Assemblies and packages including die-to-die connections
