As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which...http://www.google.fr/patents/US6919622?utm_source=gb-gplus-shareBrevet US6919622 - Semiconductor device
