A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member...http://www.google.fr/patents/US5559674?utm_source=gb-gplus-shareBrevet US5559674 - Heat sink and mounting structure for heat sink
