A semiconductor device includes a semiconductor chip, a dielectric tape layer and a printed circuit board. The semiconductor chip has a pad mounting surface with a plurality of bonding pads provided thereon. The dielectric tape layer has opposite first and second adhesive surfaces. The first adhesive...http://www.google.fr/patents/US6278183?utm_source=gb-gplus-shareBrevet US6278183 - Semiconductor device and method for manufacturing the same
Semiconductor device and method for manufacturing the same
