A frame is provided for packaging a microelectronic device. The frame is formed from a unitary member, electrically conductive device-attachable pads, and terminals in electrical communication with the device-attachable pads. The unitary member includes a base section, first and second wall sections...http://www.google.fr/patents/US20060118933?utm_source=gb-gplus-shareBrevet US20060118933 - Stackable frames for packaging microelectronic devices
Stackable frames for packaging microelectronic devices
