A method and apparatus that accurately marks a wafer at selected locations such as a defect location on the surface of a wafer such that a wafer analysis system (e.g., SEM or AFM) may rapidly find the defect. The apparatus contains a wafer platen for retaining a wafer in a substantially horizontal orientation...http://www.google.fr/patents/US6122562?utm_source=gb-gplus-shareBrevet US6122562 - Method and apparatus for selectively marking a semiconductor wafer
Method and apparatus for selectively marking a semiconductor wafer
