A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser...http://www.google.fr/patents/US6674159?utm_source=gb-gplus-shareBrevet US6674159 - Bi-level microelectronic device package with an integral window
Bi-level microelectronic device package with an integral window
