A wire bondable plastic encapsulated semiconductor device (58) having no die supporting surface can be manufactured. In one embodiment, a semiconductor die (22) and a plurality of conductors (12) extending toward the periphery of the die are provided. The die is rigidly held in place on a workholder...http://www.google.fr/patents/US5474958?utm_source=gb-gplus-shareBrevet US5474958 - Method for making semiconductor device having no die supporting surface
Method for making semiconductor device having no die supporting surface
