The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the...http://www.google.fr/patents/US5571593?utm_source=gb-gplus-shareBrevet US5571593 - Via fill compositions for direct attach of devices and methods for applying same
Via fill compositions for direct attach of devices and methods for applying same
