A connection component is provided. The connection component includes (1) a first interposer having a first surface to which a microelectronic may be mounted and a second surface opposite from the first surface, (2) a second interposer that is more flexible than the first interposer and that is disposed...http://www.google.fr/patents/US6573609?utm_source=gb-gplus-shareBrevet US6573609 - Microelectronic component with rigid interposer
