An integrated substrate comprising a heatsink base, and a multilayer circuit board bonded thereto, the multilayer circuit board having the capability to interconnect both power and control semiconductor elements and efficiently dissipate heat therefrom. A thermally conductive and electrically insulating...http://www.google.fr/patents/US6201701?utm_source=gb-gplus-shareBrevet US6201701 - Integrated substrate with enhanced thermal characteristics
Integrated substrate with enhanced thermal characteristics
