A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an encapsulating resin that encapsulates a connection part located between the semiconductor chip and the inner...http://www.google.fr/patents/US7405104?utm_source=gb-gplus-shareBrevet US7405104 - Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same
Lead frame and method of producing the same, and resin-encapsulated ...
