The disclosed method provides a method capable of removing dangling bonds generated on a surface of photodiode. The method includes steps of: forming a photodiode in a semiconductor substrate; forming a transfer transistor, a reset transistor, a drive transistor and a select transistor on the semiconductor...http://www.google.fr/patents/US6835590?utm_source=gb-gplus-shareBrevet US6835590 - Method of manufacturing image sensor for reducing dark current
Method of manufacturing image sensor for reducing dark current
