Structures, systems and methods are provide for multilevel wiring interconnects in an integrated circuit assembly which alleviate problems associated with integrated circuit size and performance. The structures, systems and methods of the present invention include a method for forming multilevel wiring...http://www.google.fr/patents/US6674167?utm_source=gb-gplus-shareBrevet US6674167 - Multilevel copper interconnect with double passivation
Multilevel copper interconnect with double passivation
