A method and system for fabricating electronic assemblies, such as multi chip modules, which include wire bonded semiconductor dice, are provided. Initially, dice having bond pads, and a substrate having corresponding bond pads, are provided. Using a wire bonding process, bonded connections are made...http://www.google.fr/patents/US6117693?utm_source=gb-gplus-shareBrevet US6117693 - System for fabricating and testing assemblies containing wire bonded semiconductor dice
System for fabricating and testing assemblies containing wire bonded ...
