A sequence of temperature control in electroless plating for microelectronic processing is disclosed in this invention. This sequence improves the uniformity of the deposit, increases the lifetime of the plating bath and is cost effective. The plating bath is heated to a temperature, which is lower than...http://www.google.fr/patents/US6875691?utm_source=gb-gplus-shareBrevet US6875691 - Temperature control sequence of electroless plating baths
Temperature control sequence of electroless plating baths
