An object of the present invention is to match impedance of each portion of whole lines of a signal wiring with the integrated circuit mounted on the package. All ground planes are deleted within a region vertically under/above a connection pad provided on the top- or bottom-surface of a polyimide multilayer...http://www.google.fr/patents/US5331204?utm_source=gb-gplus-shareBrevet US5331204 - Integrated circuit package in which impendance between signal pads and signal lines is matched by reducing the size of a ground plane
Integrated circuit package in which impendance between signal pads and ...
