Semiconductor chip manufacturing methods and devices are disclosed which store dicing data corresponding to the kinds of wafers, when data indicating the wafer kinds are input, read out the dicing data corresponding to the data input, and cut a wafer set at a given position to a desired shape in accordance...http://www.google.fr/patents/US5570293?utm_source=gb-gplus-shareBrevet US5570293 - Method and device for manufacturing a semiconductor chip
Method and device for manufacturing a semiconductor chip
