Integrated circuit dies are prepared for imaging by completely etching away all metal from the metal lines without removing barrier layers that underlie the metal lines. The metal vias may also be removed, especially if they are formed from the same metal as the metal lines, as in copper damascene circuits....http://www.google.fr/patents/US7498181?utm_source=gb-gplus-shareBrevet US7498181 - Method of preparing an integrated circuit die for imaging
Method of preparing an integrated circuit die for imaging
