An improved approach for implementing metal fill on an electrical device without causing creating cross-coupling capacitance problems is disclosed. Timing aware metal fill insertion is performed to avoid or minimize cross-capacitance problems on the IC design. A cost may be assigned to different candidate...http://www.google.fr/patents/US8161425?utm_source=gb-gplus-shareBrevet US8161425 - Method and system for implementing timing aware metal fill
Method and system for implementing timing aware metal fill
