A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory...http://www.google.fr/patents/US20030057564?utm_source=gb-gplus-shareBrevet US20030057564 - Three dimensional structure memory
Numéro de demande: 10/222,816 Numéro de publication: US 2003/0057564 A1 Date de dépôt: 19 août 2002 Brevet délivré: US7504732 ( Date de délivrance 17 mars 2009)
