A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structure embedded in a plurality of materials...http://www.google.fr/patents/US7335965?utm_source=gb-gplus-shareBrevet US7335965 - Packaging of electronic chips with air-bridge structures
Packaging of electronic chips with air-bridge structures
