The present invention provides a bond pad support structure for use in an integrated circuit having a bond pad located thereon. In one embodiment, the bond pad support structure comprises a support layer that is located below the bond pad and that has an opening formed therein. The bond pad support structure...http://www.google.fr/patents/US5986343?utm_source=gb-gplus-shareBrevet US5986343 - Bond pad design for integrated circuits
