An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity....http://www.google.fr/patents/US7364945?utm_source=gb-gplus-shareBrevet US7364945 - Method of mounting an integrated circuit package in an encapsulant cavity
Method of mounting an integrated circuit package in an encapsulant cavity
