This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. More specifically, the device, comprises a first...http://www.google.fr/patents/US7430128?utm_source=gb-gplus-shareBrevet US7430128 - Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
Capacitive/resistive devices, organic dielectric laminates and printed ...
