A method for reducing adhesive build-up on ultrasonic bonding surfaces of ultrasonic bonding systems is disclosed. The method includes providing an ultrasonic bonding surface. A pad is provided proximate to, and in fluid contact with, the ultrasonic bonding system. A fluid is conducted to the pad such...http://www.google.fr/patents/US6662992?utm_source=gb-gplus-shareBrevet US6662992 - Method and apparatus for reducing adhesive build-up on ultrasonic bonding surfaces
Method and apparatus for reducing adhesive build-up on ultrasonic bonding ...
