An interconnect structure comprising an interconnection formed between a bond pad and the end of a lead. The layer includes nickel, copper, cobalt, palladium, platinum, silver or gold and is electrically conductive. Also, an apparatus for forming an interconnection by a metal plating process and a device...http://www.google.fr/patents/US5260234?utm_source=gb-gplus-shareBrevet US5260234 - Method for bonding a lead to a die pad using an electroless plating solution
Method for bonding a lead to a die pad using an electroless plating solution
