An integrated circuit having a first plurality of wire bond pads located along a horizontal axis, a second plurality of wire bond pads located along a vertical axis, and a plurality of C4 pads arranged in a grid array wherein each grid is defined by the intersection of one of the first wire bond pads...http://www.google.fr/patents/US6727597?utm_source=gb-gplus-shareBrevet US6727597 - Integrated circuit device having C4 and wire bond connections
Integrated circuit device having C4 and wire bond connections
