A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat...http://www.google.fr/patents/US7679916?utm_source=gb-gplus-shareBrevet US7679916 - Method and system for extracting heat from electrical components
Method and system for extracting heat from electrical components
