A compliant integrated circuit (IC) wiring substrate (10) has an insulative carrier film (14) and a plurality of micro-beam conductors (12) in the carrier film. Each of the plurality of micro-beam conductors has a pair of contact bumps (16 and 18) connected to respective posts (22 and 24). A beam element...http://www.google.fr/patents/US5434452?utm_source=gb-gplus-shareBrevet US5434452 - Z-axis compliant mechanical IC wiring substrate and method for making the same
Z-axis compliant mechanical IC wiring substrate and method for making the same
