A method of securing a bond pad in to a semiconductor chip having an upper top metal surface which includes one or more holes, the method comprising the steps of forming a passivation layer over the upper metal surface, which passivation layer has holes therein substantially corresponding to the or each...http://www.google.fr/patents/US7955973?utm_source=gb-gplus-shareBrevet US7955973 - Method and apparatus for improvements in chip manufacture and design
Method and apparatus for improvements in chip manufacture and design
