The junction temperature of a die inside an electronic component is empirically determined by use of a board simulator that simulates a target board on which the electronic component is to be operated. The board simulator includes a thermoelectric cooler used to electrically control the board simulator's...http://www.google.fr/patents/US6039471?utm_source=gb-gplus-shareBrevet US6039471 - Device for simulating dissipation of thermal power by a board supporting an electronic component
Device for simulating dissipation of thermal power by a board supporting an ...
