A system for polishing a surface. The surface is positioned in contact with a rotating table having a polishing slurry or compound applied to a table surface. The pattern formed in the polishing compound as the table is rotated is monitored, and when the pattern dimensions reach a predetermined size,...http://www.google.fr/patents/US6102776?utm_source=gb-gplus-shareBrevet US6102776 - Apparatus and method for controlling polishing of integrated circuit substrates
Apparatus and method for controlling polishing of integrated circuit substrates
