An insulating layer 12 is formed as a surface layer of electronic circuit chip 10. A conductor interconnect 14 is formed in the insulating layer 12. The conductor interconnect 14 is exposed in the surface of the insulating layer 12. A solder wetting metallic film 16 (a metallic film) is formed on a portion...http://www.google.fr/patents/US7759786?utm_source=gb-gplus-shareBrevet US7759786 - Electronic circuit chip, and electronic circuit device and method for manufacturing the same
Electronic circuit chip, and electronic circuit device and method for ...
